The PELCO® Dimpler™ is the latest model in the evolution of the Dimpler line formerly available from South Bay Technology and provides Automated Precision Thinning of Specimens for TEM Analysis, for deprocessing and failure analysis, and similar applications where targeted fine polishing is required. It is a precision electro-mechanical metallographic lapping instrument that will continuously monitor and control dimpling parameters and accurately terminate at a preset specimen thickness. This electronic and mechanical integration has added repeatability and reliability to the dimpling process, as well as automation.
Active monitoring of the Z-position, feedback-controlled damping, and automated controls for determining termination of processing work together to provide repeatable, reliable results in sample preparation.
Precision polishing system for TEM specimen thinning
The PELCO® Video Alignment Microscope is an essential accessory for the PELCO® Dimpler™, particularly for deprocessing/delayering and site-specific polising applications. It allows easy targeting of an area of interest, and precise control of the position, size, and shape of the bottom of the dimple or thin area of the specimen. It is particularly useful for selective surface polishing and delayering applications, where the low point and planarity of the polished area must be controlled to reveal the feature of interest. The VAM consits of a microscope optical system with a TFT display, a post corresponding precisely to the base mount on the PELCO® Dimpler™ that is aligned to the optic axis of the microcope, a reticle to allow precise targeting of a particular area using the adjustable base, and an X-Y stage for precision alignment to the area of interest.